Specialty Materials for Electronic Assembly
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Item # 2851 FT, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Low CTE, excellent electrical insulative properties, one component version with catalyst 11




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Thermally Conductive


Handling

Viscosity at 25 ºC
85000 cps

Cure Schedule
Heat


Physical

Specific Gravity
2.25 g/cc

Hardness
94 D

Tensile Strength
7000 psi


Thermal

CTE
31 ppm/ºC

Thermal Conductivity
1.44 W/m·K

Service Temperature
–55 to 155 ºC


Electrical

Dielectric Constant at 1 MHz
5.2

Volume Resistivity at 25 ºC
1 x 1015 O/cm