Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 2850 FT-FR/Catalyst 9  
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Item # 2850 FT-FR/Catalyst 9, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Thermally Conductive, meets UL 94 V-0




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Flame Retardant

Catalyst
9


Handling

Viscosity at 25 ºC
80000 cps

Mix Ratio (wt)
100:3

Cure Schedule
Room


Physical

Specific Gravity
2.33 g/cc

Hardness
92 D

Tensile Strength
3300 psi


Thermal

CTE
21 ppm/ºC

Thermal Conductivity
1.23 W/m·K

Service Temperature
–40 to 130 ºC


Electrical

Dielectric Strength
350 V/mil

Dielectric Constant at 1 MHz
5.6

Volume Resistivity at 25 ºC
2.54 x 1015 O/cm