Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 2850 FT-FR/Catalyst 11  
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Item # 2850 FT-FR/Catalyst 11, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Thermally Conductive, meets UL 94 V-0




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Flame Retardant

Catalyst
11


Handling

Viscosity at 25 ºC
65000 cps

Mix Ratio (wt)
100:4

Cure Schedule
Heat


Physical

Specific Gravity
2.33 g/cc

Hardness
94 D

Tensile Strength
8400 psi


Thermal

CTE
30 ppm/ºC

Thermal Conductivity
1.23 W/m·K

Service Temperature
–55 to 155 ºC


Electrical

Dielectric Strength
490 V/mil

Dielectric Constant at 1 MHz
6.0

Volume Resistivity at 25 ºC
1 x 1015 O/cm