Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 2651 MM/Catalyst 9  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # 2651 MM/Catalyst 9, Epoxy Encapsulant Product


Epoxy Encapsulant Product

larger image
Non abrasive filler for machine dispense applications




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
9


Handling

Viscosity at 25 ºC
14000 cps

Mix Ratio (wt)
100:7

Cure Schedule
Room


Physical

Specific Gravity
1.58 g/cc

Hardness
88 D

Tensile Strength
6600 psi


Thermal

CTE
52.5 ppm/ºC

Thermal Conductivity
0.6 W/m·K

Service Temperature
–40 to 130 ºC


Electrical

Dielectric Strength
450 V/mil

Dielectric Constant at 1 MHz
4.42

Volume Resistivity at 25 ºC
5 x 1015 O/cm