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Specialty Materials for Electronic Assembly
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Item # 2651 MM/Catalyst 23LV
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Item # 2651 MM/Catalyst 23LV, Epoxy Encapsulant Product
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Non abrasive filler for machine dispense applications
Specifications
·
Handling
·
Physical
·
Thermal
·
Electrical
Specifications
Type
Low Viscosity
Catalyst
23LV
Handling
Mix Ratio (wt)
100:15
Cure Schedule
Room
Physical
Specific Gravity
1.52
g/cc
Hardness
86 D
Tensile Strength
8000
psi
Thermal
CTE
51.3
ppm/ºC
Thermal Conductivity
0.6
W/m·K
Service Temperature
–65 to 105
ºC
Electrical
Dielectric Strength
450
V/mil
Dielectric Constant at 1 MHz
4.8
Volume Resistivity at 25 ºC
5 x 10
15
O/cm
Specialty Materials for Electronic Assembly
Specialty Materials for Electronic Assembly