Item # 2651 MM/Catalyst 11, Epoxy Encapsulant Product On Robert McKeown Co., Inc.

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	Item # 2651 MM/Catalyst 11, Epoxy Encapsulant Product

Epoxy Encapsulant Product

Non abrasive filler for machine dispense applications

Specifications · Handling · Physical · Thermal · Electrical

Specifications

Type		Low Viscosity

Catalyst		11

Handling

Viscosity at 25 ºC		13000 cps

Mix Ratio (wt)		100:8.5

Cure Schedule		Heat

Physical

Specific Gravity		1.59 g/cc

Hardness		89 D

Tensile Strength		7000 psi

Thermal

CTE		40 ppm/ºC

Thermal Conductivity		0.6 W/m·K

Service Temperature		–55 to 155 ºC

Electrical

Dielectric Strength		450 V/mil

Dielectric Constant at 1 MHz		3.7

Volume Resistivity at 25 ºC		7 x 10¹² O/cm