Specialty Materials for Electronic Assembly
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All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 2651-40/Catalyst 23LV  
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Item # 2651-40/Catalyst 23LV, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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General purpose, meets MIL I 16923 with Catalysator 9




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Low Viscosity

Catalyst
23LV


Handling

Viscosity at 25 ºC
2200 cps

Mix Ratio (wt)
100:18

Cure Schedule
Room


Physical

Specific Gravity
1.40 g/cc

Hardness
85 D

Tensile Strength
6300 psi


Thermal

CTE
6.5 ppm/ºC

Thermal Conductivity
0.55 W/m·K

Service Temperature
–65 to 105 ºC


Electrical

Dielectric Strength
450 V/mil

Dielectric Constant at 1 MHz
3.8

Volume Resistivity at 25 ºC
1 x 1014 O/cm