Specialty Materials for Electronic Assembly
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Item # 2651-1, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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One component, general purpose




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
General Purpose


Handling

Viscosity at 25 ºC
52000 cps

Cure Schedule
Heat


Physical

Specific Gravity
1.6 g/cc

Hardness
88 D

Tensile Strength
8000 psi


Thermal

CTE
45 ppm/ºC

Thermal Conductivity
0.58 W/m·K

Service Temperature
–40 to 155 ºC


Electrical

Dielectric Strength
440 V/mil

Dielectric Constant at 1 MHz
3.7

Volume Resistivity at 25 ºC
1 x 1015 O/cm