Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1495K/Catalyst 9  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # 1495K/Catalyst 9, Epoxy Encapsulant Product


Epoxy Encapsulant Product

larger image
Low viscosity, thermally conductive




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Thermally Conductive

Catalyst
9


Handling

Viscosity at 25 ºC
10000 cps

Mix Ratio (wt)
100:4.5

Cure Schedule
Room


Physical

Specific Gravity
1.89 g/cc

Hardness
95 D

Tensile Strength
6700 psi


Thermal

CTE
42 ppm/ºC

Thermal Conductivity
1.06 W/m·K

Service Temperature
–40 to 130 ºC


Electrical

Dielectric Strength
400 V/mil

Dielectric Constant at 1 MHz
3.95

Volume Resistivity at 25 ºC
5 x 1014 O/cm