Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 1495K/Catalyst 11  
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Item # 1495K/Catalyst 11, Epoxy Encapsulant Product


Epoxy Encapsulant Product

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Low viscosity, thermally conductive




Specifications  · Handling  · Physical  · Thermal  · Electrical

Specifications

Type
Thermally Conductive

Catalyst
11


Handling

Viscosity at 25 ºC
14000 cps

Mix Ratio (wt)
100:5

Cure Schedule
Heat


Physical

Specific Gravity
1.89 g/cc

Hardness
95 D

Tensile Strength
8500 psi


Thermal

CTE
33 ppm/ºC

Thermal Conductivity
1.25 W/m·K

Service Temperature
–55 to 155 ºC


Electrical

Dielectric Strength
400 V/mil

Dielectric Constant at 1 MHz
4.09