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Specialty Materials for Electronic Assembly
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Film-PTFE High-Modulus Backing Substrates
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Part Number HM650
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Part Number HM650, Film-PTFE High-Modulus Backing Substrates
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PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Specifications
Color
White
Adhesive System
S
Backing Thickness
5.0
mil
0.127
mm
Adhesive Thickness
1.5
mil
0.038
mm
Total Thickness
6.5
mil
0.165
mm
Adhesion Strength
30
oz/in
331
g/cm
Tensile Strength
45
lb/in
8.0
kg/cm
Elongation
200
%
Dielectric
13.5
kV
Insulation Class
180
ºC
Min Temperature Range
-100
ºF
-73
ºC
Max Temperature Range
500
ºF
260
ºC
Comments
Food/Medical Grade