Specialty Materials for Electronic Assembly
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All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > High Temperature Film > Film-PTFE High-Modulus Backing Substrates > Part Number HM430  
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Part Number HM430, Film-PTFE High-Modulus Backing Substrates


Film-PTFE High-Modulus Backing Substrates

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PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.




 Specifications   

Color
White

Adhesive System
A

Backing Thickness
2.0 mil
0.064 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
3.5 mil
0.089 mm

Adhesion Strength
25 oz/in
276 g/cm

Tensile Strength
25 lb/in
4.5 kg/cm

Elongation
150 %

Dielectric
8.0 kV

Insulation Class
155 ºC

Min Temperature Range
-20 ºF
-29 ºC

Max Temperature Range
350 ºF
177 ºC

Comments
Food/Medical Grade