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Specialty Materials for Electronic Assembly
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Film-PTFE High-Modulus Backing Substrates
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Part Number HM350
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Part Number HM350, Film-PTFE High-Modulus Backing Substrates
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PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Specifications
Color
White
Adhesive System
S
Backing Thickness
2.0
mil
0.051
mm
Adhesive Thickness
1.5
mil
0.038
mm
Total Thickness
3.5
mil
0.089
mm
Adhesion Strength
25
oz/in
276
g/cm
Tensile Strength
25
lb/in
4.5
kg/cm
Elongation
150
%
Dielectric
8.0
kV
Insulation Class
180
ºC
Min Temperature Range
-100
ºF
-73
ºC
Max Temperature Range
500
ºF
260
ºC
Comments
Food/Medical Grade