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Specialty Materials for Electronic Assembly
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Film-PTFE High-Modulus Backing Substrates
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Part Number 2255-5
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Part Number 2255-5, Film-PTFE High-Modulus Backing Substrates
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2255 product series also available with silicone adhesive in 4, 6, 7 and 10 mil. backing thickness, please consult factory.
Specifications
Color
Gray
Adhesive System
S
Backing Thickness
5.0
mil
0.125
mm
Adhesive Thickness
1.5
mil
0.038
mm
Total Thickness
6.5
mil
0.165
mm
Adhesion Strength
40
oz/in
441
g/cm
Tensile Strength
60
lb/in
10.7
kg/cm
Elongation
175
%
Dielectric
15.0
kV
Insulation Class
180
ºC
Min Temperature Range
-100
ºF
-73
ºC
Max Temperature Range
500
ºF
260
ºC