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Specialty Materials for Electronic Assembly
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Film-PTFE High-Modulus Backing Substrates
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Part Number 2253-2
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Part Number 2253-2, Film-PTFE High-Modulus Backing Substrates
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2255 product series also available with silicone adhesive in 4, 6, 7 and 10 mil. backing thickness, please consult factory.
Specifications
Color
Gray
Adhesive System
A
Backing Thickness
2.0
mil
0.051
mm
Adhesive Thickness
1.5
mil
0.038
mm
Total Thickness
3.5
mil
0.089
mm
Adhesion Strength
30
oz/in
331
g/cm
Tensile Strength
30
lb/in
5.4
kg/cm
Elongation
150
%
Dielectric
9.5
kV
Insulation Class
130
ºC
Min Temperature Range
-40
ºF
-40
ºC
Max Temperature Range
350
ºF
177
ºC