Specialty Materials for Electronic Assembly
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All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > High Temperature Film > Film-PTFE Enhanced High Modulus Backing Substrates > Part Number R233  
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Part Number R233, Film-PTFE Enhanced High Modulus Backing Substrates


Film-PTFE Enhanced High Modulus Backing Substrates

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PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.




 Specifications   

Color
Gray

Adhesive System
A

Backing Thickness
5.0 mil
0.125 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
6.5 mil
0.165 mm

Adhesion Strength
30 oz/in
331 g/cm

Tensile Strength
75 lb/in
13.0 kg/cm

Elongation
150 %

Dielectric
9.5 kV

Insulation Class
130 ºC

Min Temperature Range
-40 ºF
-40 ºC

Max Temperature Range
350 ºF
177 ºC