Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Polyimide Films > Film-Polyimide Backing Substrates > Part Number K100  
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Part Number K100, Film-Polyimide Backing Substrates


Film-Polyimide Backing Substrates

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Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.




 Specifications   

Color
Amber

Adhesive System
S/S

Backing Thickness
1.0 mil
0.025 mm

Adhesive Thickness
3.5 mil
0.089 mm

Total Thickness
4.5 mil
0.114 mm

Adhesion Strength
20 oz/in
220 g/cm

Tensile Strength
30 lb/in
5.4 kg/cm

Elongation
50 %

Dielectric
7.5 kV

Insulation Class
180 ºC

Min Temperature Range
-100 ºF
-73 ºC

Max Temperature Range
500 ºF
260 ºC

Comments
Available only with liner