Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Polyimide Films > Film-Polyimide Backing Substrates > Part Number 2345-5  
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Part Number 2345-5, Film-Polyimide Backing Substrates


Film-Polyimide Backing Substrates

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Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.




 Specifications   

Color
Amber

Adhesive System
S

Backing Thickness
5.0 mil
0.127 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
6.5 mil
0.165 mm

Adhesion Strength
20 oz/in
221 g/cm

Tensile Strength
150 lb/in
26.8 kg/cm

Elongation
75 %

Dielectric
17.0 kV

Insulation Class
180 ºC

Min Temperature Range
-100 ºF
-73 ºC

Max Temperature Range
500 ºF
260 ºC