Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Electrically Conductive Tape & Composite Adhesives > Electrical Insulation and Isolation Tapes > Polyester Films > Film-Polyester Backing Substrates > Item # M60  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # M60, Film-Polyester Backing Substrates


Film-Polyester Backing Substrates

larger image
Polyester films have excellent dimensional stability, high tensile, tear, and impact strengths, and ultimate elongation up to 120% of its original dimensions. These films exhibit low water absorption and good resistance to oils, greases, strong acids, and organic solvents. They also retain electrical properties, dielectric strength and dielectric constant in continuous operating temperatures from -100°F to 350°F (-73°C to 177°C). Applications include transformer and capacitor wrapping, printed circuit board fabrication, splicing tapes, composite bonding protection, and low-cost masking.




 Specifications   

Color
Clear

Adhesive System
A

Backing Thickness
1.0 mil
0.025 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
2.5 mil
0.064 mm

Adhesion Strength
30 oz/in
331 g/cm

Tensile Strength
25 lb/in
4.5 kg/cm

Elongation
100 %

Dielectric
5.0 kV

Insulation Class
130 ºC

Min Temperature Range
-20 ºF
-29 ºC

Max Temperature Range
325 ºF
163 ºC

Comments
UL Guide OANZ2, File E51201