Specialty Materials for Electronic Assembly
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All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Foil Products > Foil-Copper Backing Substrates > Part Number C665  
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Part Number C665, Foil-Copper Backing Substrates


Foil-Copper Backing Substrates

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Aluminum and copper foil tapes offer high conformability, conductivity, and reflectivity at elevated temperatures. Aluminum is available with a fiberglass laminate for applications requiring higher tear strengths. Service temperatures range from -100°F to +500°F (-73°C to +260°C). Applications include thermal spray, aircraft repainting, EMI/RFI shielding, and electroplating.




 Specifications   

Color
Copper

Adhesive System
A

Backing Thickness
1.5 mil
0.038 mm

Adhesive Thickness
2.0 mil
0.051 mm

Total Thickness
3.5 mil
0.089 mm

Adhesion Strength
35 oz/in
386 g/cm

Tensile Strength
90 lb/in
16.0 kg/cm

Min Temperature Range
-40 ºF
-40 ºC

Max Temperature Range
250 ºF
121 ºC

Comments
UL Guide OANZ2, File E51201, UL510