CHO-FOIL EMI Shielding Tape with Conductive Adhesive (Copper, Aluminum or Tinned Copper)

Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiringmore
Unit of Measure

Specifications

Tape Description

Aluminum foil, conductive adhesive 2 sides

Tape Width

3.0 in76.2 mm

Part Number Prefix

CAD

Foil/Fabric Type

Aluminum

Foil/Fabric Thickness

2 mil0.0508 mm

Adhesive Type

Electrically Conductive, Pressure-Sensitive Acrylic

Adhesive Thickness

2 sides: each 1.5 mil2 sides: each 0.0381 mm
Total Thickness1 5.0 mil0.127 mm

Temperature Range

–40 to 400 ºF–40 to 205 ºC

Test Method Flame Resistance

UL Subject 510

Flame Resistance

Meets

Test Method Adhesion to Aluminum

ASTM D1000

Adhesion to Aluminum

> 40 oz/in2.5 ppi438 N/m

Test Method Electrical Resistance

MIL-STD-202C

Electrical Resistance

< 0.010 O/in²< 0.0016 O/cm²

Test Method Initial Surface Resistivity

CHO-TP-57

Test Method Initial Through Resistivity

CHO-TP-57
Initial Through Resistivity2 < 100 mO

Test Method Initial Peel Strength

ASTM D1000
Initial Peel Strength3 70.4 oz/in4.4 ppi710 N/m

Test Method Initial Taber Abrasion Surface Resistivity

CHO-TP-57

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity

CHO-TP-57

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity

CHO-TP-57
Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity4 < 60 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Peel

ASTM D1000

Heat Aging 185 ºF (85 ºC)/168 h, Peel

78.4 oz/in4.8 ppi840 N/m

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity

CHO-TP-57

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity

CHO-TP-57

Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity

< 10 mO

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Peel

ASTM D1000

Heat Aging 250 ºF (121 ºC)/168 h, Peel

84.8 oz/in5.3 ppi928 N/m

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity

CHO-TP-57

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity

CHO-TP-57

Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity

< 150 mO

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel

ASTM D1000

Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel

84.8 oz/in5.3 ppi928 N/m

Test Method Salt Fog Corrosion/168 h, Surface Resistivity

CHO-TP-57

Test Method Salt Fog Corrosion/168 h, Through Resistivity

CHO-TP-57

Salt Fog Corrosion/168 h, Through Resistivity

< 600 mO

Test Method Salt Fog Corrosion/168 h, Peel

ASTM D1000

Salt Fog Corrosion/168 h, Peel

80 oz/in5 ppi875 N/m

Test Method Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles

CHO-TP-57

Ordering Procedure

N/A
All CHOFOIL and CHO-FAB tapes are available in standard 36 yard (32.9 m) rolls or die-cut custom configurations. Call Chomerics’ Applications Engineering Department for assistance with a custom configuration.

Applications

N/A
Typical Applications for CHO-FOIL and CHO-FAB EMI Shielding Tapes

  • Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell
  • EMI radiation measurement troubleshooting, using CHOFOIL tape to shield ventilation slots or seam gaps
  • Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures
  • Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum
  • EMI shield for cables by wrapping the tape around the cable. An overlap is recommended
  • ESD shielding
  • Provide corrosion-resistant ground contact points
  • Fabric tape available where weight and flexibility are important, such as for wrapping cables
    • 1 Embossing adds 1.1 mil.
    • 2 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.

      For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.
    • 3 90° peel strength tests were done on an Instron at 2 inches per minute with tapes on a 2024 aluminum substrate.
    • 4 For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.