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Specialty Materials for Electronic Assembly
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Item # 0005
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Item # 0005, Conductive Sealants
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Flexible thixotropic cream system
Specifications
Filler
Ag/glass
Resin Type (Parts)
polyolefin (1)
Specific Gravity
1.7
g/cc
Max. Volume Resistivity
0.005
O/cm
RT Cure Time
72
h
Shelf Life at RT (Mos.)
9
Application
Bonding enclosures