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Specialty Materials for Electronic Assembly
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Item # XCE 3051
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Item # XCE 3051, Conductive Epoxy Adhesives
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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
Microelectronic grade, superior dispense, performance (mil spec. version available).
Specifications
Max. Volume Resistivity
1 x 10
-4
O/cm
Certified to MIL-STD-883, Method 5011
No
Viscosity
30000
cps
Work Life at Room Temperature
2 weeks
Cure
2 h at 125 ºC
Secondary Cure Option
1 h at 150 ºC
Lap Shear Strength
1650
psi
Die Shear Strength
6500
psi
Conductivity
2.4
W/m·K
Tg
103
ºC
CTE Below Tg
44
ppm/ºC
CTE Above Tg
150
ppm/ºC