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Specialty Materials for Electronic Assembly
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Item # 8177
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Item # 8177, Conductive Epoxy Adhesives
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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
High thermally conductive chip attach adhesive.
Specifications
Max. Volume Resistivity
0.0001
O/cm
Certified to MIL-STD-883, Method 5011
No
Viscosity
12000
cps
Work Life at Room Temperature
8 h
Cure
4 min at 130 ºC
Die Shear Strength
6300
psi
Conductivity
3
W/m·K