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Specialty Materials for Electronic Assembly
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Item # 8175
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Item # 8175, Conductive Epoxy Adhesives
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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
Stress absorbing adhesive designed for solder replacement
Specifications
Max. Volume Resistivity
5 x 10
-4
O/cm
Certified to MIL-STD-883, Method 5011
Yes
Viscosity
55000
cps
Work Life at Room Temperature
2 weeks
Cure
1 h at 130 ºC
Secondary Cure Option
30 min at 150 ºC
Lap Shear Strength
1650
psi
Die Shear Strength
6200
psi
Conductivity
3.2
W/m·K
Tg
90
ºC
CTE Below Tg
55
ppm/ºC
CTE Above Tg
200
ppm/ºC