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Specialty Materials for Electronic Assembly
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Item # 84-1LMIT1
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Item # 84-1LMIT1, Conductive Epoxy Adhesives
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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
Low viscosity, high thermal conductivity, exce adhesion to gold
Specifications
Max. Volume Resistivity
1 x 10
-4
O/cm
Certified to MIL-STD-883, Method 5011
Yes
Viscosity
22000
cps
Work Life at Room Temperature
2 weeks
Cure
1 h at 150 ºC
Secondary Cure Option
2 h at 125 ºC
Lap Shear Strength
1885
psi
Die Shear Strength
6600
psi
Conductivity
3.6
W/m·K
Tg
103
ºC
CTE Below Tg
52
ppm/ºC
CTE Above Tg
200
ppm/ºC