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Specialty Materials for Electronic Assembly
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Item # 84-1LMI NB
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Item # 84-1LMI NB, Conductive Epoxy Adhesives
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Emerson & Cuming offers a wide range of electrically co adhesives which have been developed for die and comp bonding. Known for their adhesion and resistance to the physical stresses, our die attach adhesives boast favora dispense properties and customized rheological characte Ultra "snap" cure (< 10 seconds) adhesives are available through-put, on-line cure methods are required to autom assembly lines.
High purity, die attach adhesive
Specifications
Max. Volume Resistivity
9 x 10
-4
O/cm
Certified to MIL-STD-883, Method 5011
Yes
Viscosity
60000
cps
Work Life at Room Temperature
3 days
Cure
30 min at 150 ºC
Die Shear Strength
3500
psi
Conductivity
4.5
W/m·K
Tg
117
ºC
CTE Below Tg
52
ppm/ºC
CTE Above Tg
150
ppm/ºC