Specialty Materials for Electronic Assembly
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All Categories > Adhesives & Sealants > Epoxy Adhesive/Sealants > Electrically Conductive Epoxy Adhesive/Sealants > Conductive Epoxy Adhesives > Item # 584-29  
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Item # 584-29, Conductive Epoxy Adhesives


Conductive Adhesive Product

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General purpose, light paste, fast heat/RT cure, 30 min. pot life, 0.025–0.127 mm bond lines, available in easy mix packs & syringes.




 Specifications   

Filler
Ag

Resin Type (Parts)
epoxy (2)

Specific Gravity
2.5 g/cc

Max. Volume Resistivity
0.002 O/cm

Lap Shear Min.
1200 psi
8274 kPa

Elevated Temperature Cure Cycle Time
0.25 h at 235 °F (113 ºC)

RT Cure Time
24 h

Working Life
30 min

Shelf Life at RT (Mos.)
9

Application
Bonding enclosures, connector shielding