Specialty Materials for Electronic Assembly
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All Categories > Adhesives & Sealants > Epoxy Adhesive/Sealants > Electrically Conductive Epoxy Adhesive/Sealants > Conductive Epoxy Adhesives > Item # 584-208  
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Item # 584-208, Conductive Epoxy Adhesives


Conductive Adhesive Product

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General purpose, medium paste, fast heat/RT cure, 1 hr. pot life, easy 1:1 mix ratio (wt.), 0.025–0.127 mm bond lines.




 Specifications   

Filler
Ag

Resin Type (Parts)
epoxy (2)

Specific Gravity
2.7 g/cc

Max. Volume Resistivity
0.005 O/cm

Lap Shear Min.
700 psi
4826 kPa

Elevated Temperature Cure Cycle Time
0.75 h at 212 °F (100 ºC)

RT Cure Time
24 h

Working Life
1 h

Shelf Life at RT (Mos.)
9

Application
Bonding enclosures