Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Adhesives & Sealants > Epoxy Adhesive/Sealants > Electrically Conductive Epoxy Adhesive/Sealants > Conductive Epoxy Adhesives > Item # 360-20  
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Item # 360-20, Conductive Epoxy Adhesives


Conductive Adhesive Product

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General purpose, very thick paste, fast heat/RT cure, < 0.254 mm bond lines.




 Specifications   

Filler
Ag/Cu

Resin Type (Parts)
epoxy (2)

Specific Gravity
5.0 g/cc

Max. Volume Resistivity
0.005 O/cm

Lap Shear Min.
1600 psi
11032 kPa

Elevated Temperature Cure Cycle Time
2 h at 150 °F (66 ºC)

RT Cure Time
24 h

Working Life
1 h

Shelf Life at RT (Mos.)
9

Application
EMI gasket attachment, bonding enclosures