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Item # T411
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Item # T411, Thermally Conductive Attachment Tapes
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THERMATTACH® T418
Extremely High Strength Heat Sink & Component Attachment Tape
T418 is the latest offering in Chomerics’ line of industry-leading thermally conductive attachment tapes. Chomerics has utilized its world-class materials science expertise and decades of applications development experience to create this superior product, offering exceptional thermal and mechanical attachment properties.
THERMATTACH® T410 and T410-R
( T410-R is a RoHS compliant version of T410 with no visual or functional difference) tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a 0.002 inch (0.05 mm) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces.
THERMATTACH® T411
tape consists of a high bond strength pressure-sensitive adhesive with an expanded aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, continued providing a high adhesive strength attachment for heat sinks. The high per-formance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces.
THERMATTACH® T413
ionically clean tapes feature a fiberglass carrier - T414 ionically clean tapes feature an electrically insulating film carrier. Both T413 and T414 double-sided adhesive tapes provide an effective thermal interface between components, ceramic hybrid circuits, printed circuit boards, flexible circuits, heat spreaders and heat sinks. Ionically clean, they provide good thermal conductivity and exceptional bonding properties - eliminating the need for thermal grease and mechanical fasteners. These tapes are embossed with a unique pattern for maximum conformability and minimal air pockets.
Specifications
Recommended for Plastic Component Attachment
Yes
Color
Clear/metallic
Embossed
No
Test metod Carrier
Visual
Reinforcement Carrier
Aluminum mesh
Test Method Thicknesses
ASTM D374
Thickness
0.25
mm
0.010
in
Thickness Tolerance
± 0.025
mm
± 0.001
in
Test Method Adhesive CTE
ASTM D3386
Adhesive CTE
400
ppm/ºC
Test Method Glass Transition Temperature
ASTM D1356
Glass Transition Temperature
–50
ºC
–58
ºF
Operating Temperature Range
–50 to 150
ºC
–58 to 302
ºF
Test Method Thermal Impedance
ASTM D5470
Thermal Impedance
6.5
ºC-cm²/W
1.0
ºC-in²/W
Test Method Thermal Conductivity
ASTM D5470
Thermal Conductivity
0.5
W/m·K
Test Method Volume Resistivity
ASTM D257
Test Method Voltage Breakdown
ASTM D149
Test Method Lap Shear Strength
ASTM D1002
Lap Shear Strength at 25 ºC, Al to Al
270
kPa
40
psi
Test Method 90º Peel Adhesion
ASTM D1000
90º Peel Adhesion to 0.002 in Aluminum Foil
3.5
N/cm
2.0
lbf/in
Test Method Die Shear Adhesion
Chomerics #54
Die Shear Adhesion after 400 psi Attachment
1
759
kPa
110
psi
Test Method Creep Adhesion
PSTC-7
Creep Adhesion at 15 ºC (77 ºF)
> 50
days
Creep Adhesion at 125 ºC (302 ºF)
> 10
days
Test Method Flammability Rating
UL 94
Flammability Rating
Not tested
Test Method RoHS Compliant
Chomeric Certification
RoHS Compliant
Yes
Test Method Shelf Life
Chomerics
Shelf Life, Months from Date of Shipment
12
1
2 h sample dwell time 25 ºC (77 ºF)