Specialty Materials for Electronic Assembly
ITARQuality Assurance Systems | ISO 9001 : 2008
All Categories > Conformal Coatings > Silicone Dow Electronics Conformal Coatings > Item # SE 9186 L  
Download PDF Download PDF     Printable Page     Email Email This Page     Save To Favorites Save To Favorites

Item # SE 9186 L, Silicone Dow Electronics Conformal Coatings


Silicone Dow® Electronics Conformal Coatings

larger image
1-part, translucent or black, fast tack-free flowable conformal coating with controlled volatility




Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Solventless RTV Elastomeric Conformal Coatings

Product Form
1-part RTV cure

Color
Black
Translucent

Viscosity
26900 mPa/s

Durometer
24 A

Specific Gravity
1.02

Room Temperature Tack-Free Time
8 min

Room Temperature Cure Time
300 min

UL 746E Approval
No

Shelf Life from Date of Manufacture
15 months

Dielectric Strength
575 V/mil
23 kV/mm

Dielectric Constant at 1 MHz
2.7

Dissipation Factor at 1 MHz
1.00E-03

Volume Resistivity
6.00E+15 O/cm


Features

Fast tack-free room-temperature cure; flowable; cures to soft, low-stress elastomer; black version is pigmented to hinder component identification; controlled silicone volatility; no added solvents


Potential Uses

Protective coating for rigid and flexible circuit boards, connectors, electronic components, or sensors; fast tack-free cure, highly controlled volatility for use around relays and high-tolerance devices (HDD, DVD, CD).


Application Methods

Applied by syringe dispense, brush or flow coating.


Cure

Time to cure is dependent on several variables including the method of application, film thickness, temperature and humidity. Tack- free time in the data table gives an indication of typical times until surface is dry enough to handle. Cure time for full cure are indications of time needed to develop full physical properties such as durometer, tensile strength or adhesion. These times, including full cure time, can be significantly improved by introducing mild heat of 60 °C or less.