Specialty Materials for Electronic Assembly
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Item # 1-4105 Conformal Coating, Silicone Dow Electronics Conformal Coatings


Silicone Dow® Electronics Conformal Coatings

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1-part, transparent, low-viscosity conformal coating




Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Solventless Heat Cure Conformal Coatings

Product Form
1-part heat cure

Color
Translucent

Viscosity
470 mPa/s

Durometer
65 OO

Specific Gravity
0.97

Heat Cure Time
10 min at 105 ºC

Flammability Classification
94 V-1

UL 746E Approval
Yes

Shelf Life from Date of Manufacture
2 months at 25 ºC; 7 at 10 ºC

Dielectric Strength
500 V/mil
19.7 kV/mm

Dielectric Constant at 100 Hz
2.63

Dielectric Constant at 100 kHz
2.63

Dissipation Factor at 100 Hz
0.0007

Dissipation Factor at 100 kHz
< 0.0002

Volume Resistivity
2.7E+13 O/cm


Features

Low viscosity; fast, low-temperature heat cure; cures to soft, low-stress elastomer; no added solvents; UV indicator for inspection; UL V-1 flammability rating


Potential Uses

Protective coating for rigid and flexible circuit boards. These heat cure, one-part, self-priming coatings cure to flexible, transparent elastomers ideally suited for electronic printed wiring board (PWB) applications, particularly those employing sensitive components and fine pitch designs.


Application Methods

Applied by dip, spray, brush, flow or automated pattern coating. The stable bath life of these materials makes them ideal for dip coating applications.


Cure

Time to cure is dependent on film thickness, type of oven, and board population density. Heat cure time in the data table gives an indication of typical times after the coating is heated to the temperature indicated. Highly populated, large, heavy boards may take longer than the indicated times due to the large thermal mass taking extra time to warm.