CHO-FOIL Conductive Tapes
Conductive Tapes/Laminates
CHO-FOIL EMI Shielding Tape with Conductive Adhesive (Copper, Aluminum or Tinned Copper)
Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring surface conductivity only. An embossed version of CHO-FOIL copper tape is also available, for a more attractive appearance up to 6 inches (152 mm) wide. Standard length rolls and die-cut custom shapes can be ordered.
CHO-FAB EMI Shielding Fabric Tape with Conductive Adhesive
CHO-FAB tape is a corrosion resistant nickel-plated cloth coated with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FAB tape is extremely strong and lightweight, and has excellent conformability/wrapability to enhance shielding performance and appearance. Use of corrosion resistant nickelplated cloth and Chomerics’ superior metal-particle-filled conductive adhesive technology produces a tape used in a wide variety of EMI shielding and grounding applications.
Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring surface conductivity only. An embossed version of CHO-FOIL copper tape is also available, for a more attractive appearance up to 6 inches (152 mm) wide. Standard length rolls and die-cut custom shapes can be ordered.
CHO-FAB EMI Shielding Fabric Tape with Conductive Adhesive
CHO-FAB tape is a corrosion resistant nickel-plated cloth coated with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FAB tape is extremely strong and lightweight, and has excellent conformability/wrapability to enhance shielding performance and appearance. Use of corrosion resistant nickelplated cloth and Chomerics’ superior metal-particle-filled conductive adhesive technology produces a tape used in a wide variety of EMI shielding and grounding applications.
Unit of Measure
Items |
/Asset/CHO-FOIL-Conductive-Tapes.jpg CCH-36-101-0050 CHO-FOIL Conductive Tapes |
/Asset/CHO-FOIL-Conductive-Tapes.jpg CCH-36-101-0100 CHO-FOIL Conductive Tapes |
/Asset/CHO-FOIL-Conductive-Tapes.jpg CCH-36-101-0150 CHO-FOIL Conductive Tapes |
/Asset/CHO-FOIL-Conductive-Tapes.jpg CCH-36-101-0200 CHO-FOIL Conductive Tapes |
/Asset/CHO-FOIL-Conductive-Tapes.jpg CCH-36-101-0300 CHO-FOIL Conductive Tapes |
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Tape Description | N/A Copper foil, conductive adhesive version | |||||||||
Tape Width | N/A 0.5 in12.7 mm | N/A 1.0 in25.4 mm | N/A 1.5 in38.1 mm | N/A 2.0 in50.8 mm | N/A 3.0 in76.2 mm | |||||
Part Number Prefix | N/A CCH | |||||||||
Foil/Fabric Type | N/A 1 oz. RA Copper | |||||||||
Foil/Fabric Thickness | N/A 1.4 mil0.0356 mm | |||||||||
Adhesive Type | N/A Electrically Conductive, Pressure-Sensitive Acrylic | |||||||||
Adhesive Thickness | N/A 1.5 mil0.0381 mm | |||||||||
Total Thickness1 | N/A 2.9 mil0.0737 mm | |||||||||
Temperature Range | N/A –40 to 400 ºF–40 to 205 ºC | |||||||||
Test Method Flame Resistance | N/A UL Subject 510 | |||||||||
Flame Resistance | N/A Pass | |||||||||
Test Method Adhesion to Aluminum | N/A ASTM D1000 | |||||||||
Adhesion to Aluminum | N/A > 40 oz/in2.5 ppi438 N/m | |||||||||
Test Method Electrical Resistance | N/A MIL-STD-202C | |||||||||
Electrical Resistance | N/A < 0.003 O/in²< 0.0005 O/cm² | |||||||||
Test Method Initial Surface Resistivity | N/A CHO-TP-57 | |||||||||
Initial Surface Resistivity2 | N/A < 2 mO | |||||||||
Test Method Initial Through Resistivity | N/A CHO-TP-57 | |||||||||
Initial Through Resistivity3 | N/A < 3 mO | |||||||||
Test Method Initial Peel Strength | N/A ASTM D1000 | |||||||||
Initial Peel Strength4 | N/A 44.8 oz/in2.8 ppi490 N/m | |||||||||
Test Method Initial Taber Abrasion Surface Resistivity | N/A CHO-TP-57 | |||||||||
Initial Taber Abrasion Surface Resistivity | N/A < 6 mO | |||||||||
Test Method Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity | N/A CHO-TP-57 | |||||||||
Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity | N/A < 10 mO | |||||||||
Test Method Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity | N/A CHO-TP-57 | |||||||||
Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity5 | N/A <16 mO | |||||||||
Test Method Heat Aging 185 ºF (85 ºC)/168 h, Peel | N/A ASTM D1000 | |||||||||
Heat Aging 185 ºF (85 ºC)/168 h, Peel | N/A 57.6 oz/in3.6 ppi630 N/m | |||||||||
Test Method Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity | N/A CHO-TP-57 | |||||||||
Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity | N/A <10 mO | |||||||||
Test Method Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity | N/A CHO-TP-57 | |||||||||
Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity | N/A < 70 mO | |||||||||
Test Method Heat Aging 250 ºF (121 ºC)/168 h, Peel | N/A ASTM D1000 | |||||||||
Heat Aging 250 ºF (121 ºC)/168 h, Peel | N/A 57.6 oz/in3.6 ppi630 N/m | |||||||||
Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity | N/A CHO-TP-57 | |||||||||
Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity | N/A | |||||||||
Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity | N/A CHO-TP-57 | |||||||||
Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity | N/A | |||||||||
Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel | N/A ASTM D1000 | |||||||||
Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel | N/A | |||||||||
Test Method Salt Fog Corrosion/168 h, Surface Resistivity | N/A CHO-TP-57 | |||||||||
Salt Fog Corrosion/168 h, Surface Resistivity | N/A | |||||||||
Test Method Salt Fog Corrosion/168 h, Through Resistivity | N/A CHO-TP-57 | |||||||||
Salt Fog Corrosion/168 h, Through Resistivity | N/A | |||||||||
Test Method Salt Fog Corrosion/168 h, Peel | N/A ASTM D1000 | |||||||||
Salt Fog Corrosion/168 h, Peel | N/A | |||||||||
Test Method Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles | N/A CHO-TP-57 | |||||||||
Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles | N/A < 3 mO | |||||||||
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