Specialty Materials for Electronic Assembly
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Polyimide Film


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Film-Polyimide Backing Substrates

Film-Polyimide Backing Substrates

(12)
Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.
Film-PTFE Skived Backing Substrates

Film-PTFE Skived Backing Substrates

(12)
PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Film-PTFE High-Modulus Backing Substrates

Film-PTFE High-Modulus Backing Substrates

(11)
PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Film-PTFE Enhanced High Modulus Backing Substrates

Film-PTFE Enhanced High Modulus Backing Substrates

(2)
PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Film-PTFE Extruded Backing Substrates

Film-PTFE Extruded Backing Substrates

(6)
PTFE films provide a conformable release surface and exhibit a remarkably low coefficient of friction and non-stick properties. PTFE films have high temperature resistance and are virtually unaffected by all chemicals. At elevated temperatures, PTFE film still retains excellent tensile strength. Service temperatures range from -100°F to +500°F (-73°F to +260°C). Film applications include high temperature coil and capacitor wrapping, composite bonding, masking, and conveyor release linings.
Film-Rulon® Backing Substrates

Film-Rulon® Backing Substrates

(2)
Rulon films offer superior abrasion resistance when compared to conventional PTFE films. Service temperatures range from -100°F to 500°F (-73°C to +260°C). In rotating bearing tests, it provided a 500-fold increase in wear resistance over standard PTFE. Applications include bearing liners, chute and guide rail coverings.
Polyimide Film Electrical Tape

Polyimide Film Electrical Tape

(5)
Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100 °F to +500 °F (-73 °C to +260 °C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance.

Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.
Polyimide (Kapton®) Product

Polyimide (Kapton®) Product

(9)
Featuring a polyimide film backing with superior heat-resistant properties, these adhesive tapes are used mainly in the insulation of electrodes in secondary batteries and heat-resistant masking in the component mounting reflow process and electronics components manufacturing process.