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Gels are a special class of encapsulants that cure to an extremely soft material. They are used to provide high levels of stress relief to sensitive circuitry. Gels perform many important functions in electronics. Their major job is to protect electronic assemblies and components from adverse environments by:
  • Functioning as dielectric insulation
  • Protecting the circuit from moisture and other contaminants
  • Relieving mechanical and thermal stress on components
Dow offers a line of standard gels, a line of low-temperature gels for applications requiring low-temperature performance. A line of toughened gels for use where chemical adhesion and dimensional stability are required, and a line of specialty gels for applications requiring low extractables, ultra-violet (UV) cure, or resistance to solvents and fuels. In addition, Dow offers custom gels that can be quickly tailored to meet specific application needs for properties such as color, viscosity, hardness, and cure rate.
Unit of Measure

Specifications

Specific Gravity1 N/A 0.97/0.96 g/cc

Type

N/A Standard Gels

Cure System

N/A Addition cure

Color

N/A Clear

Viscosity [cPs or mPa·s]

N/A 475

Penetration [1/10 of mm]

N/A 65

Gel Hardness

N/A 85 g
Shelf Life2 N/A 12 months

Working Time

N/A > 24 h

Heat Cure Time

N/A 3 at 150 ºC 5 at 125 ºC 9 at 100 ºC

Dielectric Strength

N/A 500 V/mil20 kV/mm

Dielectric Constant at 100 Hz/100 kHz

N/A 2.85/2.85

Volume Resistivity

N/A 9.50E+14 O/cm

Dissipation Factor at 100 Hz/100 kHz

N/A 0.0016/0.00007

Linear Coefficient of Thermal Expansion

N/A 425 µm/(m·ºC)

Product Form

N/A 9.50E+14

Features

N/A
0.0016/0.00007

  • 1 Cured or uncured A & B.
  • 2 Shelf life from date of manufacture for material in the original, unopened container, stored at less than 35ºC, unless otherwise noted.
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