THERMFLOW™ materials are thermally enhanced polymers designed to minimize the thermal resistance between power dissipating electronic components and their associated heat sinks. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules.
The key feature of THERMFLOW materials is their phase-change characteristic. At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces, similar to thermal grease. This ability to completely fill interfacial air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to outperform nonflowing elastomeric or graphite-based thermal pads and achieve performance comparable to thermal grease.
THERMFLOW materials are electrically non-conductive. However, since metal-to-metal contact is possible after the material undergoes phase-change in a typical heat sink assembly, THERMFLOW pads should not be used as electrical insulators.