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2-part, 1:1 mix, black, general purpose encapsulant with good flowability and flame resistance
Unit of Measure

Specifications

Type

Silicone Encapsulants

Mix Ratio

1:1

Color

Dark gray to black

Viscosity

3400 mPa/s

Durometer

40

Specific Gravity

1.38

Working Time at Room Temperature

240 min

Flammability Classification

94 V-0

UL Temperature Index, Electrical/Mechanical

170/170 ºC

Thermal Conductivity

0.39 W/m·K9.6 x 10-4 cal/cm·s-ºC

Linear Coefficient of Thermal Expansion

275 ppm

Shelf Life from Date of Manufacture

24 months

Military Specification

MIL-PRF-23586F (Grade B2)

Type, Class, Group

Type I, Class II, QPL

Dielectric Strength

475 V/mil19 kV/mm

Dielectric Constant at 100 Hz

3.17

Dielectric Constant at 100 kHz

3.16

Dissipation Factor at 100 Hz

0.0027

Dissipation Factor at 100 kHz

0.0008

Volume Resistivity

2.3 x 1013 O/cm

Features

N/A
1:1 mix ratio; low viscosity; low cost for silicone benefits; room temperature or heat accelerated cure; moderate thermal conductivity; moderate thermal conductivity; UL recognized; Mil Spec approved

Potential Uses

N/A
General potting applications: power supplies, connectors, sensors, industrial controls, transformers, amplifiers, high voltage resistor packs, relays

Application Methods

N/A
Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed in a 1:1 ratio by weight or volume; automated mixing and dispensing; manual mixing

Cure

N/A
24 hours at 25 °C (77 °F)
25 minutes at 70 °C (158 °F)
15 minutes at 85 °C (185 °F)
10 minutes at 100 °C (212 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.