Item # SE4430, Dow Electronics Thermally Conductive Adhesives/Sealants On Robert McKeown Co., Inc.

Unit of Measure

Specifications | Features | Potential Uses | Application Methods

Type	N/A Thermally Conductive Materials for Pad Manufacturing
Product Form	N/A Two-Part
Color	N/A Gray
Viscosity	N/A 5600 mPa/s
Durometer	N/A 70 OO
Penetration (1/10 of mm)	N/A 35
Tensile Strength	N/A 60 psi0.4 MPa4.2 kgf/cm²
Elongation	N/A 400 %
Specific Gravity	N/A 2.2
Linear CTE	N/A 174 µ/mC
Working Time at Room Temperature¹	N/A 4 h
Room Temperature Cure Time²	N/A 7 h
Heat Cure Time at 100 ºC (212 ºF)³	N/A 3.5 min
Heat Cure Time at 125 ºC (257 ºF)⁴	N/A 2.5 min
Heat Cure Time at 150 ºC (302 ºF)⁵	N/A 1.9 min
Thermal Conductivity⁶	N/A 0.95 W/m·K
Shelf Life from Date of Manufacture	N/A 8 months
Dielectric Strength	N/A 455 V/mil17.9 kV/mm
Dielectric Constant at 100 Hz	N/A 4.6
Dielectric Constant at 100 kHz	N/A 4.6
Dissipation Factor at 100 Hz	N/A 0.002
Dissipation Factor at 100 kHz	N/A 0.00015
Volume Resistivity	N/A 1.90E+14 O/cm

N/A
Soft; good thermal conducitvity; low viscosity

N/A
Base material for thermally conductive pads

N/A
Manual or automated meter-mix

¹ Time to double initial mixed viscosity.
² Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
³ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
⁴ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
⁵ Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
⁶ Thermal Conductivity at 25 ºC (77 ºF)

Type