Item # 340 Heat Sink Compound, Dow Electronics Thermally Conductive Adhesives/Sealants On Robert McKeown Co., Inc.

Unit of Measure

Specifications | Features | Potential Uses | Application Methods

Type	N/A Thermally Conductive Compounds
Product Form	N/A One-Part
Color	N/A White
Viscosity	N/A Nonflowing
Specific Gravity	N/A 2.1
Thermal Conductivity¹	N/A 0.59 W/m·K
Shelf Life from Date of Manufacture	N/A 60 months
Dielectric Strength	N/A 210 V/mil8.3 kV/mm
Dielectric Constant at 100 Hz	N/A 5
Dielectric Constant at 100 kHz	N/A 5
Dissipation Factor at 100 Hz	N/A 0.001
Dissipation Factor at 100 kHz	N/A 0.02
Volume Resistivity	N/A 2.00E+15 O/cm

N/A
Low bleed; stable at high temperatures

N/A
Thermal coupling of electrical/electronic devices to heat sinks

N/A
Automated or manual dispensing

Type