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Two-part; gray
Unit of Measure

Specifications

Type

Thermally Conductive Adhesives

Product Form

Two-Part

Color

Gray

Viscosity

10000 mPa/s

Durometer

67 A

Tensile Strength

400 psi2.76 MPa28.1 kgf/cm²

Elongation

35 %

Specific Gravity

2.3

Compression Modulus at 10 %

125 psi

Linear CTE

179 µ/mC
Working Time at Room Temperature1 2 h
Room Temperature Cure Time2 Material will cure after 24+ hours at room temperature, but requires heat cure for chemical bonding adhesion.
Heat Cure Time at 100 ºC (212 ºF)3 50 min
Heat Cure Time at 125 ºC (257 ºF)4 40 min
Heat Cure Time at 150 ºC (302 ºF)5 10 min

Unprimed Adhesion Lap Shear

555 psi383 N/cm²39.0 kgf/cm²
Thermal Conductivity6 1.1 W/m·K

Shelf Life from Date of Manufacture

12 months

Dielectric Strength

454 V/mil17.9 kV/mm

Dielectric Constant at 100 Hz

4.7

Dielectric Constant at 100 kHz

4.7

Dissipation Factor at 100 Hz

0.0045

Dissipation Factor at 100 kHz

0.00013

Volume Resistivity

7.20E+13 O/cm

Features

N/A
Low modulus; low viscosity; heat curable; UL94 V-0 rating

Potential Uses

N/A
Bonding heat sinks to electronics devices; bonding printed circuit boards to substrates

Application Methods

N/A
Manual or automated meter-mix and dispensing

  • 1 Time to double initial mixed viscosity.
  • 2 Cure time for 3 mm thickness at 20 °C (68 °F) and 55 % relative humidity.
  • 3 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 4 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 5 Time to 90 percent of final hardness and adhesion or 90 % of curve height for elastic modulus; additional time may be required for the part to warm to near oven temperature.
  • 6 Thermal Conductivity at 25 ºC (77 ºF)