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All Categories > Electronics Potting & Encapsulation > Silicone Potting/Encapsulants > Item # 567 Primerless Silicone Encapsulant  


Silicone-Potting-Encapsulants

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Item # 567 Primerless Silicone Encapsulant, Silicone Potting/Encapsulants

2-part, 1:1 mix, black encapsulant with good flame resistance





Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Primerless Silicone Encapsulants

Mix Ratio
1:1

Color
Black

Viscosity
1540 mPa/s

Durometer
59 (Shore 00)

Specific Gravity
1.23

Working Time at Room Temperature
> 3 days

Flammability Classification
94 V-0

UL Temperature Index, Electrical/Mechanical
105/105 ºC

Unprimed Adhesion Lap Shear
140 psi
1.0 N/cm²
10 kgf/cm²

Thermal Conductivity
0.30 W/m·K
7.2 x 10-4 cal/cm·s-ºC

Linear Coefficient of Thermal Expansion
300 ppm

Shelf Life from Date of Manufacture
24 months

Military Specification
MIL-PRF-23586F (Grade B2)

Type, Class, Group
Type I, Class IV QPL

Dielectric Strength
525 V/mil
21 kV/mm

Dielectric Constant at 100 Hz
2.85

Dielectric Constant at 100 kHz
2.79

Dissipation Factor at 100 Hz
0.008

Dissipation Factor at 100 kHz
0.002

Volume Resistivity
2.1 x 1015 O/cm


Features

1:1 mix ratio; flowable; self-priming; heat cure; UL recognized; Mil Spec approved


Potential Uses

Low cost primerless adhesion encapsula tion applications


Application Methods

Supplied as two-part liquid component kits comprised of Part A/Part B to be mixed in a 1:1 ratio by weight or volume; automated or manual mixing and dispensing can be used


Cure

120 minutes at 100 ºC (212 °F)
60 minutes at 125 °C (257 °F)
15 minutes at 150 °C (302 °F)

Note: These data were collected on 50–100 gram samples of a lot believed to be typical and should be used as initial estimates of cure times. Times will vary slightly from batch to batch and can be longer or shorter due to thermal mass of your parts and your heating ramp rate. Pretesting is recommended to confirm adequate cure for your application.
For primerless adhesion products, cure time is based on time to reach durometer. Full adhesion may take more time at the cure temperature.