Item # 2850 FT/Catalyst 23LV, Epoxy Encapsulant Product On Robert McKeown Co., Inc.

Robert Mckeown Co., Inc
111 Chambers Brook Rd.
Branchburg, NJ 08876 US
Phone: 908.218.9000 • Fax: 908.218.8949
Email: sales@robertmckeown.com


All Categories > Electronics Potting & Encapsulation > Epoxy Encapsulant Product > Item # 2850 FT/Catalyst 23LV

larger image

Item # 2850 FT/Catalyst 23LV, Epoxy Encapsulant Product

Low CTE, excellent electrical insulative properties

Specifications · Handling · Physical · Thermal · Electrical

Specifications

Type		Thermally Conductive

Catalyst		23LV

Handling

Viscosity at 25 ºC		64000 cps

Mix Ratio (wt)		100:4.5

Cure Schedule		Room

Physical

Specific Gravity		2.29 g/cc

Hardness		96 D

Tensile Strength		1740 psi

Thermal

CTE		31.2 ppm/ºC

Thermal Conductivity		1.28 W/m·K

Service Temperature		–65 to 155 ºC

Electrical

Dielectric Strength		380 V/mil

Dielectric Constant at 1 MHz		5.36

Volume Resistivity at 25 ºC		1 x 10¹⁵ O/cm

Item # 2850 FT/Catalyst 23LV, Epoxy Encapsulant Product

Type

Catalyst

Viscosity at 25 ºC

Mix Ratio (wt)

Cure Schedule

Specific Gravity

Hardness

Tensile Strength

CTE

Thermal Conductivity

Service Temperature

Dielectric Strength

Dielectric Constant at 1 MHz

Volume Resistivity at 25 ºC