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All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Polyimide Films > Film-Polyimide Backing Substrates > Part Number K102  


Film-Polyimide Backing Substrates

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Part Number K102, Film-Polyimide Backing Substrates

Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.



 Specifications 

Color
Amber

Adhesive System
A

Backing Thickness
1.0 mil
0.025 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
2.5 mil
0.064 mm

Adhesion Strength
30 oz/in
331 g/cm

Tensile Strength
30 lb/in
5.4 kg/cm

Elongation
50 %

Dielectric
7.0 kV

Insulation Class
155 ºC

Min Temperature Range
-20 ºF
-29 ºC

Max Temperature Range
350 ºF
177 ºC

Comments
Clean Release ACRYLIC Adhesive