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All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > Polyimide Films > Film-Polyimide Backing Substrates > Part Number K250  


Film-Polyimide Backing Substrates

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Part Number K250, Film-Polyimide Backing Substrates

Polyimide films are employed because of their extreme heat resistance. Service temperatures range from -100°F to +500°F (-73°C to +260°C). These flame retardant films exhibit high tensile strength and conformability, good solvent resistance, excellent dielectric strength and good abrasion resistance. Polyimide tape applications include electrical insulation, capacitor, transformer, and coil wrapping, electronic assembly, and wave solder protection.



 Specifications 

Color
Amber

Adhesive System
S

Backing Thickness
1.0 mil
0.025 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
2.5 mil
0.064 mm

Adhesion Strength
30 oz/in
220 g/cm

Tensile Strength
30 lb/in
5.4 kg/cm

Elongation
50 %

Dielectric
7.0 kV

Insulation Class
180 ºC

Min Temperature Range
-100 ºF
-73 ºC

Max Temperature Range
500 ºF
260 ºC

Comments
UL Guide OANZ2,File E51201,UL510