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All Categories > Electrically Conductive Tape & Composite Adhesives > Conductive Film Adhesives > High Temperature Film > Film-PTFE High-Modulus Backing Substrates > Part Number 2255-3  


Film-PTFE High-Modulus Backing Substrates

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Part Number 2255-3, Film-PTFE High-Modulus Backing Substrates

2255 product series also available with silicone adhesive in 4, 6, 7 and 10 mil. backing thickness, please consult factory.



 Specifications 

Color
Gray

Adhesive System
S

Backing Thickness
3.0 mil
0.076 mm

Adhesive Thickness
1.5 mil
0.038 mm

Total Thickness
4.5 mil
0.114 mm

Adhesion Strength
35 oz/in
386 g/cm

Tensile Strength
45 lb/in
8.0 kg/cm

Elongation
175 %

Dielectric
11.0 kV

Insulation Class
180 ºC

Min Temperature Range
-100 ºF
-73 ºC

Max Temperature Range
500 ºF
260 ºC