Robert McKeown Company, Inc.
Robert McKeown Company, Inc.
111 Chambers Brook Road
Branchburg NJ 08876
Toll Free: 1.800.631.1125
Phone: 908.218.9000
Fax: 908.218.8949
Email: sales@robertmckeown.com
Website: www.robertmckeown.com
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Our adhesive product line includes a series of one and two part room and thermal cure epoxy adhesives as well as UV curable adhesives. These adhesives are used in a wide range of applications meeting the customers' most demanding requirements: high strength at elevated temperatures, low stress for mismatched thermal expansion applications and outstanding chemical resistance for harsh environments.

Low CTE, excellent bond strength
Unit of Measure

Specifications

Type

 Thermally Conductive

Catalyst

 23LV

Handling

Viscosity at 25 ºC

 Paste

Mix Ratio (wt)

 100:7.3

Cure Schedule

 Room Temperature

Working Life at 25 ºC

 60 min

Physical

Specific Gravity

 2.18 g/cc

Tensile Strength

 2100 psi

Thermal

Thermal Conductivity

 1.22 W/m·K

Glass Transition Temperature

 112 ºC

Service Temperature

 –65 to 105 ºC

Electrical

Dielectric Strength

 450 V/mil

Volume Resistivity at 25 ºC

 1 x 1015 O/cm

Applications

N/A
Application considerations

Surface preparation: The first step in all adhesive applications. Substrate surfaces must be clean from dust, dirt and oils to maximize the adhesive bond strength.

Wetting: Essential to adhesive bonding. Gaps or bubbles in the bondline reduce the area of contact between the adhesive and substrate thus results in lower bond strengths.

Shrinkage: Adhesive shrinkage during cure may result in stresses at the interface leading to cracks. Flexible adhesives are better able to adjust to shrinkage induced stress than rigid systems.

Curing: Heat and room temperature cure adhesives are available to meet your application requirements of throughput and temperature ceilings.