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All Categories > Adhesives & Sealants > Epoxy Adhesive/Sealants > Thermally Conductive Epoxy Adhesive/Sealants > Film Adhesives Product > Item # CF3350  


Film Adhesives Product

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Item # CF3350, Film Adhesives Product

Emerson & Cuming offers a wide range of electrically conductive and electrically insulating film adhesives. Film adhesives are used in a variety of applications; bonding h sinks to printed circuit boards, attaching lids, bonding components, sealing hermetic packages and providing E shielding.

These tack-free film adhesives are supplied die cut to the unique geometries of customer applications. Although th products have been employed in military applications for than two decades, we are pleased to introduce film advan to a wide range of industry applications. Consider films f innovative solution to common problems associated with traditional assembly techniques.

High electrical and thermal conductivity ideal for RF power applications. Void free bondline assures consistency in operation if device.





Specifications  · Handling  · Physical  · Thermal  · Electrical  · Applications

Specifications

Type
Electrically Conducting Adhesives

Carrier
None

Film Thickness
2 mil
4 mil


Handling

Recommended Cure Schedules
10 min at 175 °C
2 h at 125 °C
30 min at 150 °C


Physical

Work Life at Room Temperature
3 months

Modulus
530 kpsi

Lap Shear Strength at 25 ºC, Al to Al
3000 psi


Thermal

Thermal Conductivity
7 W/m·K

Glass Transition Temperature
90 ºC

CTE Below Tg
65 ppm/ºC

CTE Above Tg
150 ppm/ºC


Electrical

Volume Resistivity
2 x 10-4 O/cm


Applications

Applications that benefit from film adhesives

Precision Applications with Mechanical Strength: Compared to pastes and liquid adhesives, die cut films can be precisely placed keeping adhesive where it is needed and contamination away from sensitive components.

Thermal Management: With consistent thickness and void free application, films offer inherent thermal advantages compared to traditional paste or thermal tape products. With thermal conductivity up to 7 W/mK, film products maximize thermal transfer for the most demanding heat applications.

RF and Microwave Assembly: Traditionally the realm of solder where air voids routinely require electrical adjustments and rework, the void free application of electrically conductive films are transforming the manufacture of RF and microwave assamblies.

low Temperature Lead Free Assembles: Films, as well and Emerson & Cuming/s electrically conductive adhesives, can be your solution for lead free com