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All Categories > Conformal Coatings > Silicone Dow Electronics Conformal Coatings > Item # 3-1953 Conformal Coating  


Silicone Dow® Electronics Conformal Coatings

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Item # 3-1953 Conformal Coating, Silicone Dow Electronics Conformal Coatings

1-part, transparent, medium-viscosity conformal coating; UL, IPC, and Mil Spec approved/recognized





Specifications  · Features  · Potential Uses  · Application Methods  · Cure

Specifications

Type
Solventless RTV Elastomeric Conformal Coatings

Product Form
1-part RTV cure

Color
Translucent

Viscosity
350 mPa/s

Durometer
16 A

Specific Gravity
0.99

Room Temperature Tack-Free Time
8 min

Room Temperature Cure Time
30 min

Heat Cure Time
1.5 min at 60 ºC/15 % RH

Flammability Classification
94 V-0

UL 746E Approval
Yes

Shelf Life from Date of Manufacture
12 months

Dielectric Strength
400 V/mil
16 kV/mm

Dissipation Factor at 100 Hz
0.0007

Dissipation Factor at 100 kHz
< 0.0002

Volume Resistivity
1.6E+15 O/cm


Features

Medium viscosity; room-temperature cure with optional heat acceleration; cures to soft, low-stress elastomer; UL 94V-0 recognized and Mil Spec approved; IPC- CC-830; UV indicator for inspection; no added solvents


Potential Uses

Protective coating for rigid and flexible circuit boards. These fast curing, one-part, self- priming coatings cure to flexible, transparent elastomers ideally suited for electronic printed wiring board (PWB) applications, particularly those employing sensitive components and fine pitch designs.


Application Methods

Applied by spray, brush, flow or some automated pattern coating. May be dip coated with special precautions.


Cure

Time to cure is dependent on several variables including the method of application, film thickness, temperature and humidity. Tack- free time in the data table gives an indication of typical times until surface is dry enough to handle. Cure time for full cure are indications of time needed to develop full physical properties such as durometer, tensile strength or adhesion. These times, including full cure time, can be significantly improved by introducing mild heat of 60 °C or less.