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All Categories > EMI & ESD Shielding Products > Conductive Tapes/Laminates > CHO-FOIL Conductive Tapes > Item # CCE-36-101-2400  


CHO-FOIL Conductive Tapes

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Item # CCE-36-101-2400, CHO-FOIL Conductive Tapes

CHO-FOIL EMI Shielding Tape with Conductive Adhesive (Copper, Aluminum or Tinned Copper)

Chomerics’ CHO-FOIL tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or tinned copper foil backed with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FOIL copper tape is available with a non-conductive adhesive for applications requiring surface conductivity only. An embossed version of CHO-FOIL copper tape is also available, for a more attractive appearance up to 6 inches (152 mm) wide. Standard length rolls and die-cut custom shapes can be ordered.

CHO-FAB EMI Shielding Fabric Tape with Conductive Adhesive

CHO-FAB tape is a corrosion resistant nickel-plated cloth coated with Chomerics’ highly conductive pressure-sensitive adhesive (Recognized Under the Component Program of Underwriters Laboratories, Inc.). CHO-FAB tape is extremely strong and lightweight, and has excellent conformability/wrapability to enhance shielding performance and appearance. Use of corrosion resistant nickelplated cloth and Chomerics’ superior metal-particle-filled conductive adhesive technology produces a tape used in a wide variety of EMI shielding and grounding applications.





Specifications  · Ordering Procedure  · Applications

Specifications

Tape Description
Copper foil, conductive adhesive, embossed

Tape Width
24 in
610 mm

Part Number Prefix
CCE

Foil/Fabric Type
1 oz. Embossed RA Copper

Foil/Fabric Thickness
1.4 mil
0.0356 mm

Adhesive Type
Electrically Conductive, Pressure-Sensitive Acrylic

Adhesive Thickness
1.5 mil
0.0381 mm

Total Thickness1
4.0 mil
0.1102 mm

Temperature Range
–40 to 400 ºF
–40 to 205 ºC

Test Method Flame Resistance
UL Subject 510

Flame Resistance
Meets

Test Method Adhesion to Aluminum
ASTM D1000

Adhesion to Aluminum
> 40 oz/in
2.5 ppi
438 N/m

Test Method Electrical Resistance
MIL-STD-202C

Electrical Resistance
< 0.003 O/in²
< 0.0005 O/cm²

Test Method Initial Surface Resistivity
CHO-TP-57

Initial Surface Resistivity2
< 2 mO

Test Method Initial Through Resistivity
CHO-TP-57

Initial Through Resistivity3
< 3 mO

Test Method Initial Peel Strength
ASTM D1000

Initial Peel Strength4
44.8 oz/in
2.8 ppi
490 N/m

Test Method Initial Taber Abrasion Surface Resistivity
CHO-TP-57

Initial Taber Abrasion Surface Resistivity
< 3 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity
CHO-TP-57

Heat Aging 185 ºF (85 ºC)/168 h, Surface Resistivity
< 2 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity
CHO-TP-57

Heat Aging 185 ºF (85 ºC)/168 h, Through Resistivity5
< 3 mO

Test Method Heat Aging 185 ºF (85 ºC)/168 h, Peel
ASTM D1000

Heat Aging 185 ºF (85 ºC)/168 h, Peel
62.4 oz/in
3.9 ppi
683 N/m

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity
CHO-TP-57

Heat Aging 250 ºF (121 ºC)/168 h, Surface Resistivity
< 3 mO

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity
CHO-TP-57

Heat Aging 250 ºF (121 ºC)/168 h, Through Resistivity
< 3 mO

Test Method Heat Aging 250 ºF (121 ºC)/168 h, Peel
ASTM D1000

Heat Aging 250 ºF (121 ºC)/168 h, Peel
59.2 oz/in
3.7 ppi
648 N/m

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Surface Resistivity
CHO-TP-57

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Through Resistivity
CHO-TP-57

Test Method Heat Aging with Humidity 95 % RH/ 185 ºF (85 ºC)/168 h, Peel
ASTM D1000

Test Method Salt Fog Corrosion/168 h, Surface Resistivity
CHO-TP-57

Test Method Salt Fog Corrosion/168 h, Through Resistivity
CHO-TP-57

Test Method Salt Fog Corrosion/168 h, Peel
ASTM D1000

Test Method Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles
CHO-TP-57

Taber Abrasion 500 g Weight, CS-10 Wheel, 500 Cycles
< 5 mO
1 Embossing adds 1.1 mil.
2 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.
3 All measurements of surface resistivity and through resistivity made at ambient temperature with tapes mounted on tinned copper substrate, except for taber abrasion where a plastic substrate was used.

For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.
4 90° peel strength tests were done on an Instron at 2 inches per minute with tapes on a 2024 aluminum substrate.
5 For CCD and CAD: Through resistivity measurement of double sided adhesive tapes done with tapes flanged between 2024 aluminum substrates.


Ordering Procedure

All CHOFOIL and CHO-FAB tapes are available in standard 36 yard (32.9 m) rolls or die-cut custom configurations. Call Chomerics’ Applications Engineering Department for assistance with a custom configuration.


Applications

Typical Applications for CHO-FOIL and CHO-FAB EMI Shielding Tapes

  • Provide a low impedance connection between a braided cable shield and the metal connector backshell in molded cables. An effective EMI shielded assembly can be achieved without soldering the tape to the braid or backshell
  • EMI radiation measurement troubleshooting, using CHOFOIL tape to shield ventilation slots or seam gaps
  • Provide electrical continuity in seams of EMI shielded rooms and electronic enclosures
  • Supply electrical contact to surfaces that can’t be soldered to, such as conductive plastic or aluminum
  • EMI shield for cables by wrapping the tape around the cable. An overlap is recommended
  • ESD shielding
  • Provide corrosion-resistant ground contact points
  • Fabric tape available where weight and flexibility are important, such as for wrapping cables


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